SK hynix has begun sampling its 12-layer HBM4E memory, a next-generation AI-focused DRAM designed to deliver higher performance, lower latency, and improved power efficiency.
SK hynix has introduced iHBM, a new thermal solution designed for future HBM5 memory chips. The company says the technology improves heat dissipation and helps AI hardware stay stable under demanding workloads.
Kioxia has developed a 5TB, 64GB/s flash memory module prototype designed for AI and edge computing in the post-5G era, tackling latency and bandwidth bottlenecks.