SK hynix has begun sampling its 12-layer HBM4E memory, a next-generation AI-focused DRAM designed to deliver higher performance, lower latency, and improved power efficiency.
Samsung has started shipping industry first HBM4E memory samples as the AI infrastructure race pushes demand for faster bandwidth, better thermals, and improved power efficiency in next generation data centers.
SK hynix has introduced iHBM, a new thermal solution designed for future HBM5 memory chips. The company says the technology improves heat dissipation and helps AI hardware stay stable under demanding workloads.
If you think AI progress is all about GPUs, you are missing half the story. Memory is quickly becoming the real choke point, and SK hynix seems eager to cash in on that. The company says it has kicked off mass production of a 192GB SOCAMM2 module built on its latest 1cnm LPDDR5X DRAM. That … Read more
SK hynix and Sandisk are working to standardize HBF memory under the Open Compute Project, positioning it as a new layer between HBM and SSDs for AI inference workloads. The companies say HBF can improve scalability, power efficiency, and total cost of ownership as AI shifts from training to large-scale deployment.
AI infrastructure is hitting a new limit that faster GPUs alone cannot fix. SK hynix’s Intel certified 256GB DDR5 server memory shows why capacity and efficiency now matter as much as raw compute for AI inference.